特点
The sample packaging is not suitable for automated assembly.
Version
接线方式
Reflow soldering termination (SMT)
连接方式
Motherboard to daughtercard
Mezzanine
针数
3
详细资料
According to IEC 61984, it is an unencapsulated connector. Protection against electric shock must be ensured by the type of installation by the user.
包装内容
Sample
Technical characteristics
Contact spacing (termination side)
2.54 mm
Contact spacing (mating side)
2.54 mm
Stacking height
3.25 mm
Rated current
20 A
Rated voltage
180 V
Rated voltage
acc. to IEC 60664-1
Rated impulse voltage
1.5 kV
Pollution degree
2
Clearance distance
≥1.74 mm
Creepage distance
≥1.74 mm PCB
≥1.89 mm Connector
Insulation resistance
>1010 Ω
Contact resistance
≤ 25 mΩ
Limiting temperature
-55 ... +125 °C
Performance level
1
Mating cycles
≥ 500
Test voltage Ur.m.s.
1.39 kV
Isolation group
IIIa (175 ≤ CTI < 400)
Moisture Sensitivity Level (MSL)
1 acc. to ECA/IPC/JEDEC J-STD-020D
Process Sensitivity Level (PSL)
R0 acc. to ECA/IPC/JEDEC J-STD-020D