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工业用连接器 / Han
®
圆形连接器
板端连接器
工业以太网交换机
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工业用连接器 / Han
®
矩形连接器
...
上売/底座
用于工业应用
09 62 206 0801
Osa number: 09 62 206 0801
Han 6EMC/B-HTE0-HC-for SL-HMC
Pilt on pelgalt näitlik. Vaadake tootekirjeldust.
Properties Overview
上壳
尺寸: 6 B
高结构
单锁扣
没有出线口
材料 (上壳/底座): 压铸铝
未涂装
未上漆
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Osa number: 09 62 206 0801
Han 6EMC/B-HTE0-HC-for SL-HMC
Notes
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20
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4
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28
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2
no data available
Overview
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toote detailid
标识
类别
上売/底座
上壳/底座系列
Han
®
EMC/B
上壳/底座类型
上壳
型
高结构
版本
尺寸
6 B
版本
没有出线口
锁定类型
单锁扣
应用领域
用于更高EMC要求的上壳/底座
技术参数
极限温度
-40 ... +125 °C
关于极限温度的说明
用作符合 IEC 61984 标准的连接器。
插拔次数
≥ 10,000
关于插拔次数的说明
与其他 HMC 组件配套使用的可插拔次数
防护等级符合 IEC 60529
IP65
IP66
类型等级符合 UL 50 / UL 50E
4
12
材料特性
材料 (上壳/底座)
压铸铝
表面(上壳/底座)
未涂装
颜色(上売/底座)
未上漆
规格和认证
UL / CSA
UL 1977 ECBT2.E235076
CSA-C22.2 No. 182.3 ECBT8.E235076
认证
CE
DNV GL
商业数据
包装尺寸
1
净重
135.5 g
原产国
德国
欧洲海关关税号
85389099
GTIN
5713140171565
eCl@ss
27440202 长方形连接器的外壳
ETIM
EC000437
UNSPSC 24.0
39121466
Downloads
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Data Sheet
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The data sheet in PDF format describes the general and technical properties of the product, lists the applied standards and approvals and serves as documentation.
Data Sheet
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The data sheet in PDF format describes the general and technical properties of the product, lists the applied standards and approvals and serves as documentation.
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The type sheet is a 2D figure of the product. It is available in file formats PDF, CMG and DXF.
Engineering Data
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Over 60 native formats of 2D and 3D CAD data for all common CAx tools. They can be used for a quick and easy integration of HARTING products in CAx engineering processes.
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Zuken E³.series (2019+)
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ZUKEN E3.series data from the ZUKEN Component Cloud for or quick and easy use of HARTING products in ZUKEN E³.series (2019+). The library data includes all important information such as:
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Further Documents
Asset Administration Shell
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AAS
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The AAS data is organised in a structured way according to an open standard from IDTA (
International Digital Twin Association
), using a data model that allows different systems and applications to interact with the Asset Administration Shell in a standardised and interoperable way. This enables seamless integration and communication between different systems and applications. Further information can be found
here
.
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